Roll Your Own Adventure – Semis companies are trading at all-time high valuations, but there is an ocean of competitors out there, including some of the biggest customer for those chips. Fun times.
Meta’s struggles with designing their own silicon for their AR glasses shows that rolling your own silicon does not make sense for all companies.
Companies designing their own silicon are motivated by the ability this gives them to control the roadmap and features of new chips.
Google has a new chip – the TiN – for networking. An interesting chip in its own right but we also see it as a sign that Google is creating tools that let any software coder design a chip. And if Google can do it, maybe everyone else will too. Someday.
The cloud service providers – AWS, GCP and Azure – have to support the software of all their customers, this complicates the case for them building their own chips.
RISV V’s leading proponent SiFive has some great momentum, but it also faces many obstacles ahead.
AI is appearing everywhere, but at heart it is just a highly efficient solution to a specific set of computer science problems – this is sparking a new class of opportunity for chip companies and IP providers to tap into the opportunity.
Part of the magic of semis is the ability to integrate multiple chips into a single chip. History shows, that the vendor whose chip sits closest to a system’s critical software wins the strategic high ground. What will that mean in autos?
AWS announced updates to two of its chips last week. And while we wonder why they didn’t announce more, their new chips demonstrate just how serious they are about rolling their own silicon (and how big Intel’s problems are).
Two Chinese companies – Tencent and Innosilicon – launched chips this month that look to be important steps forward for China’s semis efforts.