Meta’s struggles with designing their own silicon for their AR glasses shows that rolling your own silicon does not make sense for all companies.
Part of the magic of semis is the ability to integrate multiple chips into a single chip. History shows, that the vendor whose chip sits closest to a system’s critical software wins the strategic high ground. What will that mean in autos?
Nvidia’s Analyst Day demonstrated the company is now the leading force in the data center. They have risen to this crest on the back of some incredible execution, and their rise shows the very powerful wave washing through the market for compute semis。
RISV V’s leading proponent SiFive has some great momentum, but it also faces many obstacles ahead.
We believe, with increasing conviction, that the market for IoT chips is not going to go to Arm. But it is not going to go to x86 or Intel either. It is going to go RISC V.
Google recently published a paper on the history of its TPU chip. There are some valuable nuggets of information in here that can help others think about building chips, and also help outsiders understand many of the changes in the semis industry today.
The auto industry has a difficult relationship with semiconductors. Building their own chips is probably not a solution.
AWS announced updates to two of its chips last week. And while we wonder why they didn’t announce more, their new chips demonstrate just how serious they are about rolling their own silicon (and how big Intel’s problems are).
Two Chinese companies – Tencent and Innosilicon – launched chips this month that look to be important steps forward for China’s semis efforts.
Before we get to autonomous vehicles, there is going to be a big market for a special-purpose automotive processors (APU?). That chip is going to look a lot like a mobile app processor, and Qualcomm may be the best positioned to capture the opportunity.